Thermal management system controlling dynamic and steady state thermal loads
US10132529B2 · kind B2 · utility
2Cited by
28References
19Claims
0Family size
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Key dates
| Filing date | Jan 29, 2016 |
| Grant date | Nov 20, 2018 |
| Priority date | — |
| Expiry date | Nov 13, 2036 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF25B2400/24
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A thermal management system includes a closed dynamic cooling circuit, and a closed first steady-state cooling circuit. Each circuit has its own compressor, heat rejection exchanger, and expansion device. A thermal energy storage (TES) system is configured to receive a dynamic load and thermally couple the dynamic cooling circuit and the first steady-state cooling circuit. The dynamic cooling circuit is configured to cool the TES to fully absorb thermal energy received by the TES when a dynamic thermal load is ON, and the steady-state cooling circuit is configured to cool the TES when the dynamic thermal load is OFF.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.