Device and method for cooling a unit
US10132560B2 · kind B2 · utility
0Cited by
12References
12Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Aug 14, 2012 |
| Grant date | Nov 20, 2018 |
| Priority date | — |
| Expiry date | Oct 9, 2033 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R33/3804
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
The present invention relates to a method and a device (1) for cooling an arrangement (2) using a cold head (3), with a thermal cooling of the unit (2) to be cooled by means of the thermosiphon principle. At the same time, heat is conducted via a mechanical heat bridge (5), which provides a direct thermal connection from the cold head (3) to the unit (2) to be cooled.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.