Methods and apparatuses for cutter path planning and for workpiece machining
US10133260B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Dec 5, 2014 |
| Grant date | Nov 20, 2018 |
| Priority date | — |
| Expiry date | Jul 5, 2035 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG05B2219/35121
- WIPO fieldControl
- WIPO sectorInstruments
Abstract
A method for cutter path planning is disclosed. The method includes: obtaining a first and a second programmed path of a workpiece, computing for a corresponding first cutter path based on the first programmed path and a radius of the cutter, and computing for a corresponding second cutter path based on the second programmed path and the radius of the cutter; and computing for a transition path connecting an end point of the first cutter path and a start point of the second cutter path based on the first and second cutter paths, wherein the distance from any one point on the transition path to either the first or second programmed path would be greater than or equal to the radius of the cutter. An apparatus for cutter path planning, a method and an apparatus for workpiece machining are also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.