Gaming computer with structural cooling arrangement
US10133322B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 21, 2017 |
| Grant date | Nov 20, 2018 |
| Priority date | — |
| Expiry date | Sep 21, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L23/467
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A computer assembly, having a generally parallelepiped shape with regard to a set of three orthogonal axis XYZ, includes a mother board and an auxiliary board, a first cooling loop with a first heat-intake exchanger in contact with at least one processing unit of the mother board, and a first heat-discharge exchanger, and fluid connections, a second cooling loop with a second heat-intake exchanger in contact with at least one processing unit of the auxiliary board, and a second heat-discharge exchanger, and fluid connections. The first heat-discharge exchanger comprises a first strength member extending at least along a plane XZ and a plurality of first air-cooled fins. The second heat-discharge exchanger comprises a second strength member extending at least along a plane YZ a plurality of second air-cooled fins. The first strength member is fixed to the second strength member to form thereby the structural chassis of the computer assembly.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.