Method for manufacturing electronic element including transparent conductive structure
US10134992B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 16, 2017 |
| Grant date | Nov 20, 2018 |
| Priority date | — |
| Expiry date | May 16, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10K50/828
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Provided is a method for manufacturing an electronic device including a transparent conductive structure, the method including preparing a transparent electrode in which, among a first region and a second region, the first region is selectively surface-modified, preparing a mixed composition including a first composition and a second composition having a different polarity from the first composition, and applying the mixed composition onto the transparent electrode, wherein the applied mixed composition is disposed in the surface modified first region, and the mixed composition disposed in the first region is phase-separated into a first composition layer and a second composition layer disposed on the first composition layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.