Phased array for millimeter-wave mobile handsets and other devices
US10135149B2 · kind B2 · utility
10Cited by
3References
20Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Feb 10, 2014 |
| Grant date | Nov 20, 2018 |
| Priority date | — |
| Expiry date | May 27, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01Q1/243
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
An apparatus includes an antenna element. The antenna element includes a first portion of a multi-layer printed circuit board (PCB) and a cap covering at least part of the first portion of the multi-layer PCB. The multi-layer PCB includes multiple substrates, and the first portion of the multi-layer PCB includes a first slot through the multiple substrates. The cap includes a second slot and defines a space between the first portion of the multi-layer PCB and the cap. The cap and a conductive layer of the multi-layer PCB form a waveguide structure through which wireless signals radiate from the antenna element.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.