Patent · US Active

Electronic device housing and manufacturing method thereof by die-casting an aluminum alloy

US10135959B2 · kind B2 · utility

0Cited by

0References

7Claims

0Family size

Assignees

GUANGDONG JANUS INTELLIGENT GROUP CORP., LTD · CN
DONGGUAN JANUS ELECTRONIC PRECISION COMPONENTS CO. LTD. · CN

Inventors

Zhen Tang · Suzhou, CN
Xi FAN · Beijing, CN
Shoude Xie · Dongguan, CN
Changming Wang · Nanjing, CN
Yunbin Li · Tangxia, CN
Kaifu Liu · Tangxia, CN
Shenghui Zhou · Tangxia, CN
Xu Lu · Beijing, CN

Key dates

Filing date	Aug 31, 2015
Grant date	Nov 20, 2018
Priority date	—
Expiry date	Aug 31, 2035

Classification

Technology area (CPC H)Electricity
CPC primaryH04M1/02
WIPO fieldTelecommunications
WIPO sectorElectrical engineering

Abstract

An electronic device housing (100) comprises outer frame (10) and a die casting inner frame (20). The die casting inner frame is shaped by means of die casting and is jogged in the outer frame. The present invention also comprises a method for manufacturing the electronic device housing.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.