Methods of forming a microelectronic device structure, and related microelectronic device structures and microelectronic devices
US10136520B2 · kind B2 · utility
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10References
12Claims
0Family size
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Key dates
| Filing date | Jul 3, 2017 |
| Grant date | Nov 20, 2018 |
| Priority date | — |
| Expiry date | Jul 3, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10287
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of forming a microelectronic device structure comprises coiling a portion of a wire up and around at least one sidewall of a structure protruding from a substrate. At least one interface between an upper region of the structure and an upper region of the coiled portion of the wire is welded to form a fused region between the structure and the wire.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.