Low profile, highly configurable, current sharing paralleled wide band gap power device power module
US10136529B2 · kind B2 · utility
2Cited by
7References
28Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 15, 2016 |
| Grant date | Nov 20, 2018 |
| Priority date | — |
| Expiry date | Aug 15, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of making a power module includes providing a base plate defining a topology pattern, providing a power substrate above the base plate, providing at least two power contacts and arranging solder catches in the at least two power contacts, soldering the at least two power contacts to the power substrate utilizing the solder catches, and securing a housing to the power substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.