Patent · US Active

Low profile, highly configurable, current sharing paralleled wide band gap power device power module

US10136529B2 · kind B2 · utility

2Cited by
7References
28Claims
0Family size

Assignee

Inventors

Key dates

Filing dateAug 15, 2016
Grant dateNov 20, 2018
Priority date
Expiry dateAug 15, 2036

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01L2924/0002
  • WIPO fieldSemiconductors
  • WIPO sectorElectrical engineering

Abstract

A method of making a power module includes providing a base plate defining a topology pattern, providing a power substrate above the base plate, providing at least two power contacts and arranging solder catches in the at least two power contacts, soldering the at least two power contacts to the power substrate utilizing the solder catches, and securing a housing to the power substrate.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.