Modular assembly for multidimensional transducer arrays
US10137477B2 · kind B2 · utility
1Cited by
5References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 17, 2015 |
| Grant date | Nov 27, 2018 |
| Priority date | — |
| Expiry date | Feb 28, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04R1/1033
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
An interconnect is provided for a multidimensional transducer array. An adaptor provides a 90-degrees or other non-zero angle transition of conductors from connection with the elements to connection with a printed circuit board. The adaptor is formed as a component that may surface mount on the printed circuit board and may provide a pitch change from the element pitch to a different pitch, such as a pitch of conductors of an integrated circuit also mounted to the printed circuit board. The adaptor allows stacking of modules where each module uses standardized or regular printed circuit board connections.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.