Tooling and a method for weakening an outline in a thin plastics card
US10137591B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 25, 2014 |
| Grant date | Nov 27, 2018 |
| Priority date | — |
| Expiry date | Jun 25, 2034 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB26F1/40
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Disclosed are a method of weakening an outline in a thin plastic card and tooling for performing the method. The method may include several operations, including a go punching step by means of a go punch presenting a solid shape substantially identical to the outline and suitable for punching the thin plastic card along a go direction against a die presenting a hollow shape substantially identical to the outline and in alignment with the go punch in order to be able to receive material pushed by the go punch, and a return punching step by means of a return punch presenting a solid shape substantially identical to the outline in alignment with the go punch and suitable for punching the thin plastic card along a return direction opposite to the go direction. Also disclosed is a thin plastic card including at least one outline weakened by such a method.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.