Power heat dissipation device
US10137752B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 28, 2015 |
| Grant date | Nov 27, 2018 |
| Priority date | — |
| Expiry date | Dec 28, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L23/38
- WIPO fieldTransport
- WIPO sectorMechanical engineering
Abstract
A power heat dissipation device includes a heat-conducting layer, a heat sink and at least one cooling chip. The heat-conducting layer has a heat-absorbing surface and a heat-dissipating surface. The heat sink is in thermal contact with the heat-dissipating surface, and a heat-conducting section is formed in the heat sink. The cooling chip is embedded in the heat sink and disposed adjacent to the heat transferring channel. The cooling chip has a cooling surface which is perpendicular to the heat-absorbing surface. The cooling surface faces the heat transferring channel. The cooling chip removes heat from the heat-conducting section in the heat sink.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.