Lead-through or connecting element with improved thermal loading capability

US10138157B2 · kind B2 · utility

Assignee

• Schott AG · DE

Inventors

• Oliver Fritz · Landshut, DE
• Georg Meier · Obersüßbach, DE
• Thomas Fink · Tipp City, US

Key dates

• Filing date: Jun 22, 2017
• Grant date: Nov 27, 2018
• Expiry date: Jun 22, 2037

Classification

• Technology area (CPC C): Chemistry; Metallurgy
• CPC primary: C03C2204/00
• WIPO field: Materials, metallurgy
• WIPO sector: Chemistry

Abstract

A lead-through or connecting element is provided that includes an assembly having a carrier body of a high-temperature alloy, a functional element, and an at least partially crystallized glass. The crystallized glass is between a portion of the functional element and a portion of the carrier body. The carrier body subjects the crystallized glass to a compressive stress of greater than or equal to zero, at a temperature from at least 20° C. to more than 450° C. Also provided are a method for producing a lead-through or connecting element, the use of such a lead-through or connecting element, and to a measuring device including such a lead-through or connecting element.