Patent · US Active

Thermoplastic molding compounds with optimized flowability-toughness ratio

US10138364B2 · kind B2 · utility

0Cited by

5References

20Claims

0Family size

Assignee

INEOS STYROLUTION GROUP GMBH · DE

Inventors

Norbert Niessner · Friedelsheim, DE
Philipp Boeckmann · Bad Dürkheim, DE
Roland Walker · Osnabrück, DE
Marcus Reining · Ludwigshafen, DE

Key dates

Filing date	Jan 27, 2015
Grant date	Nov 27, 2018
Priority date	—
Expiry date	Jan 27, 2035

Classification

Technology area (CPC C)Chemistry; Metallurgy
CPC primaryC08L2205/025
WIPO fieldOther special machines
WIPO sectorMechanical engineering

Abstract

The invention relates to a thermoplastic composition containing the components A and B and optionally the additional components C and D, the sum of which equals 100 wt. %. The molding compound consists of: a) 60 to 75 wt. % of one or more styrene copolymers A, b) 25 to 40 wt. % of one or more graft copolymers B, c) 0 to 15 wt. % of a rubber C which is different from component B, and d) 0 to 5 wt. % of one or more additives D. The composition contains 0.2 to 3.0 wt. %, based on the total weight of the components A to D, of oligomers, can be readily processed, and leads to scratch-resistant molded parts.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.