Sputtering target
US10138544B2 · kind B2 · utility
0Cited by
53References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 27, 2012 |
| Grant date | Nov 27, 2018 |
| Priority date | — |
| Expiry date | Jan 12, 2034 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB22D25/06
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A method for casting a reactive material PVD target, as well as targets thus obtained and a mold for casting. The method includes providing a mold defining an opening, placing a reactive material ingot in to a reservoir (140) proximate the mold, forming a vacuum and melting the reactive material in the reservoir, heating the mold to above a casting temperature and forming a vacuum therein, introducing molten reactive material from the reservoir into the opening and cooling the mold to form the PVD target.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.