Process for the removal of contaminants from sputtering target substrates
US10138545B2 · kind B2 · utility
0Cited by
6References
18Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Feb 2, 2017 |
| Grant date | Nov 27, 2018 |
| Priority date | — |
| Expiry date | May 22, 2037 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC11D2111/46
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
The present invention provides a process for the removal of contaminants on a spent sputtering target used in Plasma Vapor Deposition by the steps of grit abrasion, organic solvent cleaning, and being subjected to an electric field in an acidic bath including a surfactant, and followed by subsequent water and air rinse and further grit abrasion. Removal of the contaminants is verified by spectroscopy.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.