Molding assembly and floor installation
US10138639B2 · kind B2 · utility
2Cited by
15References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 7, 2017 |
| Grant date | Nov 27, 2018 |
| Priority date | — |
| Expiry date | Jul 7, 2037 |
Classification
- Technology area (CPC E)Fixed Constructions
- CPC primaryE04F19/068
- WIPO fieldCivil engineering
- WIPO sectorOther fields
Abstract
Provided herein is a molding assembly for bridging a gap between floor covering materials, or for finishing an edge of a floor covering material. The molding assembly comprising a molding and a track is configured with a hinge portion to allow tilting of the molding when attached to the track attachment component. Floor installations are also provided herein. The floor installations comprise floor covering materials adjoining respective sides of a gap, and a molding assembly to cover the gap and accommodate any difference in thickness between the respective adjoining floor covering materials.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.