Heat dissipation structure and device
US10139170B2 · kind B2 · utility
1Cited by
1References
14Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Mar 15, 2016 |
| Grant date | Nov 27, 2018 |
| Priority date | — |
| Expiry date | Nov 25, 2036 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02E60/14
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
According to one embodiment, a heat dissipation structure includes a heat dissipating unit and a heat accumulating unit. The heat dissipating unit includes at least one extending part which extends in a first direction, and is configured to be thermally connected to an apparatus which is configured to produce heat. The heat accumulating unit includes an accommodating unit which is configured to be thermally connected to the extending part, a heat storage material sealed inside the accommodating unit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.