Methods for in-plane strain measurement of a substrate
US10139295B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 14, 2016 |
| Grant date | Nov 27, 2018 |
| Priority date | — |
| Expiry date | May 14, 2036 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24446
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Methods for measuring and/or mapping in-plane strain of a surface of a substrate. A grating is formed on at least a portion of the surface of the substrate. A laser is then used focused onto the grating to determine the strain on the surface by determining the variation of the grating wavelength due to the strain on the surface. The strain information is essentially carried by the grating, in terms of grating wavelength, because it varies according to the volume change of the underlying substrates. By scanning the surface grating with the small laser size, a high resolution strain map of the surface can be produced. The induced strain is related to the grating wavelength variation, which leads to the diffraction angle variation that is captured by the strain sensing measurements.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.