Patent · US Active

Vertically integrated optoelectronics package for MEMS devices

US10139564B1 · kind B1 · utility

18Cited by

21References

20Claims

0Family size

Assignee

National Technology & Engineering Solutions of Sandia, LLC · US

Inventors

Brian D. Homeijer · Albuquerque, US
Matt Eichenfield · Albuquerque, US

Key dates

Filing date	Jan 28, 2016
Grant date	Nov 27, 2018
Priority date	—
Expiry date	May 20, 2037

Classification

Technology area (CPC H)Electricity
CPC primaryH01S5/423
WIPO fieldOptics
WIPO sectorInstruments

Abstract

The present application relates to vertically integrated assemblies including a MEMS-based optomechanical architecture. In some embodiments, the assembly includes a MEMS/optoelectronic module, an emitter module, and a detector module, where these modules are vertically integrated. Methods of fabricating such assemblies are also described herein.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.