Monitoring device, monitoring method, and device for cutting and grinding display substrate
US10139802B2 · kind B2 · utility
1Cited by
3References
16Claims
0Family size
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Key dates
| Filing date | Jul 17, 2015 |
| Grant date | Nov 27, 2018 |
| Priority date | — |
| Expiry date | Jan 7, 2037 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG05B2219/49073
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The present disclosure provides a monitoring device, a monitoring method and a device for cutting a display substrate. The monitoring device includes an infrared temperature detection module configured to detect a temperature at a contacting position where a cutter wheel is in contact with the display substrate when cutting the display substrate with the cutter wheel, so as to acquire a temperature parameter at the contacting position; and a processing module configured to generate, based on the temperature parameter, a corresponding control parameter for controlling the process of cutting the display substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.