Surface-mountable over-current protection device
US10141089B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 30, 2017 |
| Grant date | Nov 27, 2018 |
| Priority date | — |
| Expiry date | Nov 30, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH02H9/026
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A surface-mountable over-current protection device comprises at least one chip, a first lead and a second lead. The chip comprises a PTC material layer and two metal electrode layers disposed on upper and lower surfaces of the PTC material layer. The first lead is bent into multiple portions comprising a first electrode connecting portion connecting to one of the two metal electrode layers of the at least one chip and a first soldering portion for surface-mounting. The second lead is bent into multiple portions comprising a second electrode connecting portion connecting to another one of the two electrode layers of the at least one chip and a second soldering portion for surface-mounting. The PTC material layer comprises crystalline polymer and conductive filler dispersed therein, and the conductive filler has a resistivity less than 500μΩ·cm. The surface-mountable over-current protection device can withstand a cycle life test of 300 cycles at 20V/40A without blowout.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.