Apparatus and method for manufacturing electronic component
US10141108B2 · kind B2 · utility
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1References
5Claims
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Assignee
Inventor
Key dates
| Filing date | Apr 28, 2016 |
| Grant date | Nov 27, 2018 |
| Priority date | — |
| Expiry date | Apr 28, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH02K3/50
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
An apparatus for manufacturing an electronic component includes a grip unit configured to grip an electronic member having a plurality of projections arranged thereon, a connected coil assembly forming unit configured to form a connected coil assembly in which a plurality of single coils are connected to one another, and a coil mounting unit configured to sequentially mount the plurality of single coils of the connected coil assembly on the plurality of projections.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.