Thin film fuse
US10141149B2 · kind B2 · utility
0Cited by
9References
5Claims
0Family size
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Key dates
| Filing date | Jan 30, 2017 |
| Grant date | Nov 27, 2018 |
| Priority date | — |
| Expiry date | Jan 30, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10181
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A thin film fuse is formed by two substantially planar conductors, separated from each other by a thin gap. The conductors and gap are over-coated with a thin, conductive material having a surface tension when melted, great enough to pull the conductive material out of the gap.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.