Direct bonded copper power module with elevated common source inductance
US10141254B1 · kind B1 · utility
10Cited by
3References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 14, 2018 |
| Grant date | Nov 27, 2018 |
| Priority date | — |
| Expiry date | May 14, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19107
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A direct bonded copper (DBC) power module with elevated common source inductance is adapted for use as a half bridge in an electric drive for an electric vehicle. Etching patterns on the DBC substrates provide indented notches for concentrating magnetic flux in the power loops. Etched gate traces form gate loops with coil windings disposed within or overlapping the notches in order to enhanced the common source inductance for each switching transistor (such as an IGBT). Switching loss is reduced and fuel economy is improved for the electric vehicle with minimal impact on packaging size and at no additional cost.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.