Driving chip bump having irregular surface profile, display panel connected thereto and display device including the same
US10141292B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 13, 2017 |
| Grant date | Nov 27, 2018 |
| Priority date | — |
| Expiry date | Sep 13, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/14
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A display device includes: a display panel driven to display an image, the display panel including a substrate including a display area at which the image is displayed; a terminal pad on the substrate and through which a driving signal is applied to the display area; a driving chip through which the driving signal is applied to the terminal pad; and a non-conductive film which fixes the driving chip to the substrate. The driving chip includes: a non-conductive elastic support body projected from a surface of the driving chip; a bump wiring on the non-conductive elastic support body, the bump wiring directly contacting the terminal pad to apply the driving signal to the terminal pad; and a dispersed particle on the non-conductive elastic support body.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.