Peeling method using separating peeling layer and layer to be peeled
US10141526B2 · kind B2 · utility
3Cited by
16References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 31, 2016 |
| Grant date | Nov 27, 2018 |
| Priority date | — |
| Expiry date | Aug 31, 2036 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A flexible device is provided. The hardness of a bonding layer of the flexible device is set to be higher than Shore D of 70, or preferably higher than or equal to Shore D of 80. The coefficient of expansion of a flexible substrate of the flexible device is set to be less than 58 ppm/° C., or preferably less than or equal to 30 ppm/° C.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.