High Q quartz-based MEMS resonators and method of fabricating same
US10141906B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | May 6, 2016 |
| Grant date | Nov 27, 2018 |
| Priority date | — |
| Expiry date | May 6, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH03H2009/155
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
A method of fabricating a resonator includes providing a first quartz substrate, forming a metallic etch stop on a first surface of the first quartz substrate; attaching, using a temporary adhesive, the first surface of the first quartz substrate to a second quartz substrate, etching an opening for a via in a second surface of the first quartz substrate to the metallic etch stop, forming a metal electrode on the second surface of the first quartz substrate, the metal electrode penetrating the via in the first quartz substrate to make ohmic contact with the metallic etch stop, bonding the metal electrode formed on the second surface of the first quartz substrate to a pad formed on a host substrate; and dissolving the temporary adhesive to release the second quartz substrate from the first quartz substrate, wherein the first quartz substrate and the host substrate each comprise crystalline quartz.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.