Substrate for printed circuit board and method for producing substrate for printed circuit board
US10143083B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Dec 18, 2015 |
| Grant date | Nov 27, 2018 |
| Priority date | — |
| Expiry date | Dec 18, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/0269
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A substrate for a printed circuit board according to an embodiment of the present invention includes a base film having an insulating property, and a metal layer formed on at least one surface side of the base film. In the substrate for a printed circuit board, a plurality of fine particles are disposed between the base film and the metal layer, and the fine particles are formed of a metal the same as a main metal of the metal layer or formed of a metal compound of the main metal. The fine particles preferably have an average particle size of 0.1 nm or more and 20 nm or less. The fine particles are preferably formed of a metal oxide or a metal hydroxide. The fine particles are preferably present between the base film and the metal layer so as to form a layer. The metal layer preferably includes a metal grain layer formed by firing metal nanoparticles.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.