Method to suppress period doubling during manufacture of micro and nano scale wrinkled structures
US10144172B2 · kind B2 · utility
Inventor
Key dates
| Filing date | Feb 2, 2016 |
| Grant date | Dec 4, 2018 |
| Priority date | — |
| Expiry date | Jul 30, 2036 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29L2031/7736
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
The range of stretch-tunability of sinusoidal wrinkled surfaces that are obtained by compression of supported thin films is limited by the emergence of a period-doubled mode at high compressive strains. This disclosure presents a method to suppress the emergence of the period-doubled mode at high strains. This is achieved by compressing pre-patterned supported thin films, wherein the pre-patterns are substantially similar to the natural pattern of the supported thin film system. As compared to flat thin film systems, pre-patterned thin film systems exhibit period doubling behavior at a higher compressive strain. The onset strain for emergence of period-doubling is tuned by altering the amplitude of the pre-patterns.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.