Patent · US Active

Bonded packaging system for foods

US10144553B2 · kind B2 · utility

0Cited by

6References

16Claims

0Family size

Assignee

BASF SE

Inventors

Christof Van Sluijs · Leeuwarden, NL
Ivette Garcia Castro · Ludwigshafen, DE
Cedric Du Fresne Von Hohenesche · Almere, NL
Meik Ranft · Bensheim, DE

Key dates

Filing date	Jun 25, 2013
Grant date	Dec 4, 2018
Priority date	—
Expiry date	Oct 20, 2035

Classification

Technology area (CPC B)Performing Operations; Transporting
CPC primaryB32B27/32
WIPO fieldSurface technology, coating
WIPO sectorChemistry

Abstract

The present invention relates to a new, adhesively bonded packaging system for foods, more particularly for dairy products.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.