Method of manufacturing a sensor
US10144636B2 · kind B2 · utility
1Cited by
0References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 26, 2016 |
| Grant date | Dec 4, 2018 |
| Priority date | — |
| Expiry date | Sep 26, 2036 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81C2203/0792
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
A sensor for measuring, for example, the pressure of a gas or other fluid comprising a glass substrate having an aperture defined therethrough. A semiconductor die defining a diaphragm is anodically bonded to the glass substrate such that the diaphragm is exposed via the aperture. At least one electrically conductive element in electrical communication with the semiconductor die is arranged on a surface of the glass substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.