Copolyamides, moulding compounds comprising these and moulded articles produced therefrom
US10144805B2 · kind B2 · utility
11Cited by
4References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 5, 2016 |
| Grant date | Dec 4, 2018 |
| Priority date | — |
| Expiry date | Nov 14, 2036 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L77/06
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The invention relates to copolyamides which are formed from a diamine component, a dicarboxylic acid component and possibly a lactam- and/or ω-amino acid component. Furthermore, the invention relates to a polyamide moulding compound which comprises at least one of these copolyamides. Moulded articles produced from these moulding compounds are used in the automobile field, in the domestic field, in measuring-, regulating- and control technology or in mechanical engineering.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.