Melt in place binders for binding particulate fillers to substrates
US10144834B2 · kind B2 · utility
0Cited by
11References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 30, 2014 |
| Grant date | Dec 4, 2018 |
| Priority date | — |
| Expiry date | Jul 25, 2035 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31935
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The invention relates to the use of a melt-in-place acrylic binder that is applied to a substrate in the form of a powder, followed by a fusing together of the binder powder by heat or radiation. Particulate filler is present either on the substrate, mixed with the binder powder, or admixed into the binder powder prior to fusion. The fused binder helps adhere the particulate fillers to the substrate, and may or may not cover the particulate filler.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.