Bonded structure and bonding-condition detecting method
US10145786B2 · kind B2 · utility
1Cited by
9References
10Claims
0Family size
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Key dates
| Filing date | Feb 27, 2014 |
| Grant date | Dec 4, 2018 |
| Priority date | — |
| Expiry date | Mar 8, 2034 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N2201/088
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A bonded structure includes a first member, a second member, an adhesive that bonds the first member and the second member together, and an optical fiber sandwiched between the first member and the second member. When pressure is applied to the optical fiber only from a predetermined direction, the sectional shape of the optical fiber changes to an elliptical shape, so that birefringence occurs, whereby the shape of the light spectrum changes so as to have multiple peaks. The optical fiber is used as a sensor for detecting the bonding condition between the first member and the second member based on the birefringence.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.