Multilayer ceramic electronic component and method of manufacturing the same
US10147547B2 · kind B2 · utility
0Cited by
3References
4Claims
0Family size
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Key dates
| Filing date | Nov 17, 2017 |
| Grant date | Dec 4, 2018 |
| Priority date | — |
| Expiry date | Nov 17, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01G4/224
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A multilayer ceramic electronic component includes an inner layer part comprising dielectric layers and internal electrodes that are alternately disposed; and cover parts disposed on upper and lower surfaces of the inner layer part. The cover parts contain a nickel metal.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.