Method of manufacturing a semiconductor device using a mounting apparatus
US10147653B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 19, 2018 |
| Grant date | Dec 4, 2018 |
| Priority date | — |
| Expiry date | Feb 19, 2038 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/53022
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A mounting apparatus is provided which includes a frame having a table, a support member disposed on the table to support a substrate, and a feeder mounted on a feeder mount unit disposed in the frame at one side of the table. The feeder provides an element to be attached to the substrate. An element value measuring unit is disposed adjacent one side of the frame and directly measures an element value of the element. A head unit picks up the element from the feeder, inputs the element into the element value measuring unit, and/or attaches the element to the substrate. A control device controls operations of the feeder and the head unit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.