Power module having dual-sided cooling
US10147665B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Jun 30, 2017 |
| Grant date | Dec 4, 2018 |
| Priority date | — |
| Expiry date | Jun 30, 2037 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02T10/64
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A power module having dual-sided cooling is provided with a semiconductor chip between an upper board and a lower board of the power module. In particular, the upper board includes: a first bonding layer made of a dielectric material, and a first electrode made of a copper material and provided on a first surface of the first bonding layer, and the first electrode is connected to the semiconductor chip. The lower board includes: a second bonding layer made of a dielectric material, and a second electrode made of a copper material and provided on a first surface of the second bonding layer, and the second electrode is connected to the semiconductor chip. More specifically, a thickness of the first electrode is greater than a thickness of the first bonding layer, and a thickness of the second electrode is greater than a thickness of the second bonding layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.