Dual module for dual chip card
US10147670B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 1, 2016 |
| Grant date | Dec 4, 2018 |
| Priority date | — |
| Expiry date | Apr 1, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/49171
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A dual module for a dual chip card includes a supporting film supporting on an outer surface, a plurality of connecting pads including two series of connecting pads extending in a given direction and, on an inner surface, two inner connection areas for connection to an antenna of the dual card and a chip, the chip including contact terminals connected by wires to the inner connection areas or electric connecting pads by holes passing through the supporting film while being coated, together with the wires, by coating resin. The electric connecting pads of the outer surface include only three pads. Each of the two inner connection areas forms a comb including a body extending under each of the pads of one of the two series of connecting pads separated from the coating mass, respectively. Blades extend separately from one another from the body until ends covered by the coating mass.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.