Method for manufacturing integrated substrate for organic light emitting diode, organic light emitting diode, and method for manufacturing organic light emitting diode
US10147900B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 6, 2017 |
| Grant date | Dec 4, 2018 |
| Priority date | — |
| Expiry date | Feb 19, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2221/6835
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Provided are a method for manufacturing an integrated substrate for an organic light emitting diode, an organic light emitting diode, and a method for manufacturing an organic light emitting diode, wherein the method for manufacturing an organic light emitting diode may include forming a sacrificial layer on a release substrate, forming a first electrode on the sacrificial layer, forming on the first electrode an auxiliary electrode pattern having an opening, forming a buffer layer on the auxiliary electrode pattern and in the opening, providing a substrate on the buffer layer, removing the release substrate and the sacrificial layer to expose a first surface of the first electrode, and laminating an organic light emitting layer and a second electrode on the first surface of the first electrode.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.