Packaging method, display panel and display apparatus
US10147901B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 19, 2015 |
| Grant date | Dec 4, 2018 |
| Priority date | — |
| Expiry date | Aug 19, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10K2102/00
Abstract
A packaging method, a display panel, and a display apparatus. The packaging method comprises steps of: forming a frit layer in a packaging area of a first substrate; forming at least a metal thin film and/or at least a silicon thin film on the frit layer formed on the first substrate, and forming at least a metal thin film and/or at least a silicon thin film in a packaging area of a second substrate, wherein one of the outermost thin film formed on the frit layer and the outermost thin film formed is a metal thin film, and the other is a silicon thin film; and vacuum laminating the first substrate and the second substrate, without the use of a laser to irradiate the frit layer during the packaging.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.