Method for solderless electrical press-in contacting of electrically conductive press-in pins in circuit boards
US10148054B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 19, 2015 |
| Grant date | Dec 4, 2018 |
| Priority date | — |
| Expiry date | Nov 22, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0285
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A method is described for solderless electrical press-in contacting of conductive press-in pins in circuit boards, the method comprising the following steps: Providing a circuit board having at least one contacting opening for press-in contacting; providing at least one press-in component having at least one conductive press-in pin; providing a sonotrode for exerting a force and for applying ultrasonic energy. In order to electrically and mechanically contact press-in pins to a circuit board by means of ultrasonic press-in technology, it is provided that the press-in component together with its press-in pin, is fixated during a press-in step, in particular held firmly in place, and that a force and ultrasonic energy are directly applied to the circuit board by means of the sonotrode such that the circuit board is pressed at the location of its contacting opening onto the press-in pin, not directly acted upon by the sonotrode, of the press-in component.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.