Front-end integrated circuit for WLAN applications
US10149347B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 6, 2016 |
| Grant date | Dec 4, 2018 |
| Priority date | — |
| Expiry date | Jan 15, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH03F2203/7209
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
Front-end integrated circuit for wireless local area network WLAN applications. In some embodiments, a semiconductor die can include a semiconductor substrate, and a power amplifier implemented on the semiconductor substrate and configured for WLAN transmit operation associated with a frequency range. The semiconductor die can further include a low-noise amplifier (LNA) implemented on the semiconductor substrate and configured for WLAN receive operation associated with the frequency range. The semiconductor die can further include a transmit/receive switch implemented on the semiconductor substrate and configured to facilitate the transmit and receive operations.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.