Trench cutting with laser machining
US10149391B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 8, 2016 |
| Grant date | Dec 4, 2018 |
| Priority date | — |
| Expiry date | Jun 2, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/107
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Systems and techniques are provided for trench cutting with laser machining. A laminate material including a conductive layer and a non-conductive layer may be cut with a first cut using a UV-laser. The cutting of a second cut, using the UV-laser, may be started at a top electrode of the non-conductive layer based on the location of the first cut, wherein the second cut is wider than the first cut. The cutting of the second cut may be stopped partially though the non-conductive layer. The stopping of the cutting of the second cut partially though the non-conductive layer may include stopping the cutting of the second cut before cutting a bottom electrode of the non-conductive layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.