Circuit assembly for an electronic device
US10149396B2 · kind B2 · utility
1Cited by
71References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 15, 2016 |
| Grant date | Dec 4, 2018 |
| Priority date | — |
| Expiry date | Sep 15, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1327
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Embodiments relate to systems and methods for forming a circuit assembly for an electronic device. The circuit assembly may include a substrate and a group of surface-mounted electronic components disposed on a surface of the substrate. An electrical connector may be disposed on the surface and may be configured to receive an electrical connection from a separate electrical component or assembly. A molded layer may be formed over at least a portion of the surface fully encapsulating the group of surface-mounted electronic components and partially encapsulating the electrical connector.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.