Component mounting method and component mounting system
US10149420B2 · kind B2 · utility
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7Claims
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Key dates
| Filing date | Jul 8, 2015 |
| Grant date | Dec 4, 2018 |
| Priority date | — |
| Expiry date | Dec 12, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K13/085
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A component mounting method is provided in a component mounting apparatus that mounts a component onto a board using a plurality of pieces of production data linked to component data. The method includes executing, when the component data is changed, a simulation of a production cycle time based on the production data, and comparing a simulation result of the production cycle time after change of the component data with a production cycle time or a simulation result of the production cycle time before change of the component data, and outputting a comparison result.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.