Adhesive dispensing system and method using smart melt heater control
US10150137B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 24, 2016 |
| Grant date | Dec 11, 2018 |
| Priority date | — |
| Expiry date | Oct 24, 2036 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T137/6416
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An adhesive dispensing system is disclosed. The system includes a heater unit configured to heat an adhesive to an application temperature, a fill system configured to supply the adhesive to said heater unit, and a controller. The controller is configured to actuate the fill system to supply the adhesive to the heater unit, operate the heater unit to maintain a unit set point temperature sufficient to heat the adhesive to the application temperature, and operate the heater unit to reduce its temperature from the unit set point temperature following a first set threshold time from actuation of the fill system to supply the adhesive to the heater unit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.