Patent · US Active

Panel laminating method, panel assembly and electronic device

US10150279B2 · kind B2 · utility

0Cited by

0References

6Claims

0Family size

Assignee

HTC Corporation · TW

Inventors

Chu-Chun Lo · Daxi District, TW
Hung-Wei Wu · Daxi District, TW

Key dates

Filing date	Feb 7, 2014
Grant date	Dec 11, 2018
Priority date	—
Expiry date	Apr 13, 2034

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T428/24752
WIPO fieldSurface technology, coating
WIPO sectorChemistry

Abstract

A panel laminating method is provided with the following steps. A transparent adhesive layer is formed on a first panel. At least a portion of the transparent adhesive layer is pre-cured to increase the viscosity of the transparent adhesive layer. After the transparent adhesive layer is pre-cured, a second panel is stacked on the transparent adhesive layer. After the second panel is stacked on the transparent adhesive layer, the entire of the transparent adhesive layer is main-cured so that the second panel is laminated to the first panel through the transparent adhesive layer. Besides, a panel assembly and an electronic device are also provided.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.