Pressure-sensitive adhesives for bonding flexible printing plates

US10150320B2 · kind B2 · utility

Assignee

• tesa SE · DE

Inventors

• Kai Ellringmann · Hamburg, DE
• Kristin Kerber · Hamburg, DE
• Benjamin Pütz · Neuss, DE

Key dates

• Filing date: Jul 18, 2017
• Grant date: Dec 11, 2018
• Expiry date: Jul 18, 2037

Classification

• Technology area (CPC C): Chemistry; Metallurgy
• CPC primary: C09J2433/00
• WIPO field: Basic materials chemistry
• WIPO sector: Chemistry

Abstract

Pressure-sensitive adhesives and methods, for bonding flexible printing plates, comprising at least one adhesive component comprising at least one polymer component based on a monomer mixture comprising at least one of the following monomers: at least one acrylic ester; at least one methacrylic ester; acrylic acid; and methacrylic acid. The pressure-sensitive adhesives further comprise 1 to 30 wt %, based on the overall blend of the at least one adhesive component without solvent, of a polyvinyl acetate.