Manufacturing method of metal mask and mask for deposition using said method
US10151041B2 · kind B2 · utility
5Cited by
3References
15Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Sep 25, 2015 |
| Grant date | Dec 11, 2018 |
| Priority date | — |
| Expiry date | Dec 9, 2035 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D1/10
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A mask manufacturing method, including manufacturing a first mold, including forming first patterns having inclined surfaces by patterning a silicon substrate; manufacturing a second mold, including forming second patterns that correspond to the first patterns by coating and curing a hardener on a surface of the first mold in which the first patterns are formed; separating the second mold from the first mold; forming a mask pattern by coating a metal layer on the second mold; and separating the metal layer from the second mold.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.